Methods of reducing or eliminating deposits after electrochemical plating in an electroplating processor

Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual...

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Bibliographic Details
Main Authors Crane, Stuart, Stolt, Timothy G, Youngbull, Tricia A, Bergman, Eric J
Format Patent
LanguageEnglish
Published 28.06.2022
Subjects
APPARATUS THEREFOR
CHEMISTRY
CLEANING
CLEANING IN GENERAL
ELECTROFORMING
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PERFORMING OPERATIONS
PREVENTION OF FOULING IN GENERAL
PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
TRANSPORTING
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Summary:Methods and apparatus for reducing the formation of insoluble deposits in semiconductor electrochemical plating equipment or a surface thereof during electrochemical plating, including: removing electrochemical plating equipment or a surface thereof from an electroplating solution, wherein residual electroplating solution is disposed atop the electrochemical plating equipment or a surface thereof, and wherein the residual electroplating solution has a first pH; contacting the residual electroplating solution with a rinse agent having a second pH similar to the first pH to form a rinsate; and removing the rinsate from the electrochemical plating equipment or a surface thereof.
Bibliography:Application Number: US201916449358