Zipper tape, bag with zipper tape, method for manufacturing bag with zipper tape, long member-bonding method capable of favorably bonding long members, device therefor, and zipper tape-bonding device

• Main Authors: Namba, Yoshinori, Kakigami, Koji, Goto, Shuichi, Katada, Ryo
• Format: Patent
• Language: English
• Published: 28.06.2022
• Subjects: ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; CLADDING OR PLATING BY SOLDERING OR WELDING; CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS,e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES,DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; CONVEYING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; HANDLING THIN OR FILAMENTARY MATERIAL; MACHINE TOOLS; MACHINES, APPARATUS OR DEVICES FOR, OR METHODS OF, PACKAGINGARTICLES OR MATERIALS; MAKING ARTICLES OF PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNERANALOGOUS TO PAPER; MAKING CONTAINERS OF PAPER, CARDBOARD OR MATERIAL WORKED IN AMANNER ANALOGOUS TO PAPER; METAL-WORKING NOT OTHERWISE PROVIDED FOR; PACKAGES; PACKAGING ELEMENTS; PACKING; PERFORMING OPERATIONS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; SOLDERING OR UNSOLDERING; STORING; TRANSPORTING; UNPACKING; WELDING; WORKING BY LASER BEAM; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL; WORKING PAPER, CARDBOARD OR MATERIAL WORKED IN A MANNER ANALOGOUSTO PAPER

A light-absorbing layer and a bonding layer are layered on a first side of each of a belt-shaped male base portion integrated with a male portion and a female base portion integrated with a female portion on a side of the male and female base portions opposite the first side. The light-absorbing layer contains a light-absorbing material having a wavelength absorption range from 800 nm to 1200 nm to absorb a laser beam of the range. The bonding layer contains a low-melting-point resin in a form of a metallocene linear low-density polyethylene having a melting point ranging from 60 degrees C. to 120 degrees C. When the zipper tape is bonded to the base film, the laser beam is applied to heat the light-absorbing layer to melt the bonding layer. The melted bonding layer is pressure-bonded to the base film. The base film can be bonded without causing thermal degradation.