Delayed activation of no-heat liquid solder in a wellbore
Metal material coated with a layer that is controllably activated can be positioned downhole in a wellbore prior to performing a wellbore operation. After the wellbore operation is performed, the layer can be activated to release the metal material.
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
21.06.2022
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Subjects | |
Online Access | Get full text |
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Summary: | Metal material coated with a layer that is controllably activated can be positioned downhole in a wellbore prior to performing a wellbore operation. After the wellbore operation is performed, the layer can be activated to release the metal material. |
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Bibliography: | Application Number: US202016746515 |