Delayed activation of no-heat liquid solder in a wellbore

Metal material coated with a layer that is controllably activated can be positioned downhole in a wellbore prior to performing a wellbore operation. After the wellbore operation is performed, the layer can be activated to release the metal material.

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Bibliographic Details
Main Authors Lewis, Samuel J, Turton, Simon David, Vargo, Jr., Richard F, Pearl, Jr., William Cecil
Format Patent
LanguageEnglish
Published 21.06.2022
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Summary:Metal material coated with a layer that is controllably activated can be positioned downhole in a wellbore prior to performing a wellbore operation. After the wellbore operation is performed, the layer can be activated to release the metal material.
Bibliography:Application Number: US202016746515