Fabrication method of flexible electronic package device
A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
14.06.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A fabrication method of a flexible electronic package device including the following steps is provided. A tolerable bending radius of the flexible electronic package device is obtained. A minimum surface curvature radius of a selected portion of an applied carrier is obtained. A relationship of the tolerable bending radius being smaller than the minimum surface curvature radius is ensured. The flexible electronic package device is disposed on the selected portion. |
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Bibliography: | Application Number: US202017126033 |