Epoxy resin systems

Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylph...

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Bibliographic Details
Main Authors Taylor, Leeanne, Hale, Alla, Sepulveda-Camarena, Diana, Bansal, Amitabh, Chung, Jennifer W, Corley, Larry Steven
Format Patent
LanguageEnglish
Published 14.06.2022
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Summary:Compositions and methods for forming epoxy resin systems are provided. In one embodiment, a composition is provided for an epoxy resin system including an epoxy resin blend comprising an epoxy resin, a first curing agent selected from the group of a polyarylene alkylphosphonate, a polyarylene arylphosphonate, and combinations thereof, and a second curing agent.
Bibliography:Application Number: US201816126612