Bonding with pre-deoxide process and apparatus for performing the same

A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package...

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Bibliographic Details
Main Authors Huang, Ying-Jui, Hsiao, Yi-Li, Yu, Chen-Hua, Hsieh, Ching-Hua, Yang, Su-Chun, Shao, Tung-Liang, Tung, Chih-Hang, Hwang, Chien Ling
Format Patent
LanguageEnglish
Published 24.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A method includes picking up a first package component, removing an oxide layer on an electrical connector of the first package component, placing the first package component on a second package component after the oxide layer is removed, and bonding the first package component to the second package component.
Bibliography:Application Number: US201916264957