Integrated circuit packaging method and integrated packaging circuit

• Main Authors: Guo, Yuejin, Liu, Junjun, Hu, Chuan, Prack, Edward Rudolph
• Format: Patent
• Language: English
• Published: 17.05.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

An integrated circuit packaging method and an integrated packaging circuit, the integrated circuit packaging method including: circuit layers are provided on the top surface of a substrate, the bottom surface of the substrate or the interior of the substrate, the circuit layers having circuit pins; the substrate is provided with connection through holes, and the connection through holes are joined up with the circuit pins; a device is placed on the substrate, and the device is provided with device pins on a surface facing the substrate, which makes the device pins join up with a first opening of the connection through holes; conductive layers are fabricated in the connection through holes by means of a second opening of the connection through holes; and the conductive layers electrically connect the device pins to the circuit pins.