Electrostatic chuck device and method of manufacturing electrostatic chuck device

• Main Authors: Ozaki, Masaki, Morishita, Norito
• Format: Patent
• Language: English
• Published: 10.05.2022
• Subjects: BASIC ELECTRIC ELEMENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOTDIRECTED TO A PARTICULAR RESULT; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; CORONA DEVICES; DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g.ARRANGEMENTS FOR COPYING OR CONTROLLING; ELECTRIC MACHINES NOT OTHERWISE PROVIDED FOR; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATING IONS TO BE INTRODUCED INTO NON-ENCLOSED GASES; GENERATION; MACHINE TOOLS; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OFPARTICULAR DETAILS OR COMPONENTS; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OVERVOLTAGE ARRESTERS USING SPARK GAPS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SPARK GAPS; SPARKING PLUGS; TRANSPORTING

An electrostatic chuck device (1) including: an electrostatic chuck part (2) which includes a base material (11) having a mounting surface (11a) on which a plate-like sample W is mounted, and an internal electrostatic attraction electrode (13) which electrostatically attracts the plate-like sample (W) to the mounting surface (11a); a cooling base part (3) which is configured to cool the electrostatic chuck part (2); and an adhesive layer (4) which is interposed therebetween, in which a shape of the mounting surface of the base material (11) includes a concave surface (23) or a convex surface, which is a curved surface that gradually curves from a center (11b) of the mounting surface (11a) toward an outer periphery (11c) of the mounting surface (11a) and includes no inflection point, and an absolute value of a difference between a height of a center of the concave surface (23) or the convex surface from a position of a main surface (3a) of the cooling base part (3) as a reference and a height of an outer periphery of the concave surface (23) or the convex surface from the position of the main surface (3a) of the cooling base part (3) as a reference is 1 μm or higher and 30 μm or lower.