Pad structure for front side illuminated image sensor

• Main Authors: Yaung, Dun-Nian, Ting, Shyh-Fann, Hsu, Kai-Chun, Wang, Ching-Chun, Lin, Jeng-Shyan
• Format: Patent
• Language: English
• Published: 03.05.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

The present disclosure relates to an integrated circuit. The integrated circuit includes a plurality of interconnects within a dielectric structure over a substrate. A passivation structure is arranged over the dielectric structure. The passivation structure has sidewalls connected to one or more up...