Pad structure for front side illuminated image sensor

The present disclosure relates to an integrated circuit. The integrated circuit includes a plurality of interconnects within a dielectric structure over a substrate. A passivation structure is arranged over the dielectric structure. The passivation structure has sidewalls connected to one or more up...

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Bibliographic Details
Main Authors Yaung, Dun-Nian, Ting, Shyh-Fann, Hsu, Kai-Chun, Wang, Ching-Chun, Lin, Jeng-Shyan
Format Patent
LanguageEnglish
Published 03.05.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:The present disclosure relates to an integrated circuit. The integrated circuit includes a plurality of interconnects within a dielectric structure over a substrate. A passivation structure is arranged over the dielectric structure. The passivation structure has sidewalls connected to one or more upper surfaces of the passivation structure. A bond pad is arranged directly between the sidewalls of the passivation structure. An upper passivation layer is disposed over the passivation structure and the bond pad. The upper passivation layer extends from over an upper surface of the bond pad to within a recess in the upper surface of the bond pad.
Bibliography:Application Number: US202017070430