Component with improved heat dissipation

In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient αLS, which is substantially higher than the first...

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Bibliographic Details
Main Authors Jewula, Tomasz, Meister, Veit
Format Patent
LanguageEnglish
Published 12.04.2022
Subjects
BASIC ELECTRONIC CIRCUITRY
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
RESONATORS
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Summary:In a component with component structures generating dissipation heat, it is proposed to apply on an active side of the substrate a heat-conducting means to the back side of the component substrate, which has a second thermal conductivity coefficient αLS, which is substantially higher than the first thermal conductivity coefficient αS of the substrate. The heat dissipation then succeeds via the heat-conducting means and via connecting means which connect the substrate to a carrier.
Bibliography:Application Number: US201615743984