Hybrid conductor integration in power rail

Certain aspects of the present disclosure generally relate to integration of a hybrid conductor material in power rails of a semiconductor device. An example semiconductor device generally includes an active electrical device and a power rail. The power rail is electrically coupled to the active ele...

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Bibliographic Details
Main Authors Zhu, John Jianhong, Rim, Kern, Song, Stanley Seungchul
Format Patent
LanguageEnglish
Published 12.04.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Certain aspects of the present disclosure generally relate to integration of a hybrid conductor material in power rails of a semiconductor device. An example semiconductor device generally includes an active electrical device and a power rail. The power rail is electrically coupled to the active electrical device, disposed above the active electrical device, and embedded in at least one dielectric layer. The power rail includes a first conductive layer, a barrier layer, and a second conductive layer. In certain cases, copper may be used as conductive material for the second conductive layer. The barrier layer is disposed between the first conductive layer and the second conductive layer.
Bibliography:Application Number: US202016738127