Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

• Main Authors: Mehta, Vipul, Cetegen, Edvin, Zhong, Shan, Gujjula, Sushrutha, Wei, Yuying, Ananthakrishnan, Nisha, Lin, Ziyin
• Format: Patent
• Language: English
• Published: 22.03.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes...