Micro-electronic package with substrate protrusion to facilitate dispense of underfill between a narrow die-to-die gap

A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes...

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Bibliographic Details
Main Authors Mehta, Vipul, Cetegen, Edvin, Zhong, Shan, Gujjula, Sushrutha, Wei, Yuying, Ananthakrishnan, Nisha, Lin, Ziyin
Format Patent
LanguageEnglish
Published 22.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrate protrusion is described. The substrate protrusion includes a top portion that extends in a first direction toward a gap between the first die and the second die and in a second direction parallel to the gap between the first die and the second die. The substrate protrusion also includes a base portion that is coupled to a substrate that extends underneath the first die and the second die. The substrate protrusion can enable void-free underfill.
Bibliography:Application Number: US201815942109