Integrated circuit package and system using same

Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact d...

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Bibliographic Details
Main Authors Boone, Mark R, Henschel, Mark E
Format Patent
LanguageEnglish
Published 01.03.2022
Subjects
BASIC ELECTRIC ELEMENTS
DEVICES USING STIMULATED EMISSION
DIAGNOSIS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HUMAN NECESSITIES
HYGIENE
IDENTIFICATION
MEDICAL OR VETERINARY SCIENCE
SEMICONDUCTOR DEVICES
SURGERY
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Summary:Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The integrated circuit package includes first and second active dies. Each of the first and second active dies includes a top contact disposed on the top surface of the die and a bottom contact disposed on a bottom surface of the die. The package further includes a via die having first and second vias that each extends between a top contact disposed on a top surface of the via die and a bottom contact disposed on a bottom surface of the via die, where the bottom contact of the first active die is electrically connected to the bottom contact of the first via of the via die and the bottom contact of the second active die is electrically connected to the bottom contact of the second via of the via die.
Bibliography:Application Number: US201816148702