Multilayer ceramic capacitor with interposing molybdenum (Mo) ground layer

A multilayer ceramic capacitor includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces of...

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Bibliographic Details
Main Authors Yanagisawa, Atsuhiro, Namiki, Satoko, Yamatoh, Tomonori, Ubukata, Haruna
Format Patent
LanguageEnglish
Published 01.03.2022
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Summary:A multilayer ceramic capacitor includes: a multilayer chip having a parallelepiped shape in which each of a plurality of dielectric layers and each of a plurality of internal electrode layers are alternately stacked and each of the internal electrode layers is alternately exposed to two end faces of the multilayer chip, a main component of the plurality of dielectric layers being a ceramic; and a pair of external electrodes that are formed on the two end faces; wherein: the pair of external electrodes have a structure in which a plated layer is formed on a ground layer; a main component of the ground layer is a metal or an alloy including at least one of Ni and Cu; and at least a part of a surface of the ground layer on a side of the plated layer includes an interposing substance including Mo.
Bibliography:Application Number: US201916417323