Method for fabricating a semiconductor device

• Main Authors: Choi, Sang-Il, Jeon, Seong Gi, Kang, Tae Gyu, Nho, Hee Seok
• Format: Patent
• Language: English
• Published: 25.01.2022
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A method for fabricating a semiconductor device includes: providing a first wafer including a base substrate having a first surface and a second surface facing each other, and an element region disposed on the first surface of the base substrate, in which the first wafer includes a first semiconduct...