Semiconductor device and method for fabricating the same
A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a silicon layer on the substrate, a titanium nitride (TiN) layer on the silicon layer, a titanium (Ti) layer between the TiN layer and the silicon layer, a metal silicide between the Ti layer and th...
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Main Authors | , , , , , , , , , , , , |
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Format | Patent |
Language | English |
Published |
11.01.2022
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor device includes a gate structure on a substrate, in which the gate structure includes a silicon layer on the substrate, a titanium nitride (TiN) layer on the silicon layer, a titanium (Ti) layer between the TiN layer and the silicon layer, a metal silicide between the Ti layer and the silicon layer, a titanium silicon nitride (TiSiN) layer on the TiN layer, and a conductive layer on the TiSiN layer. |
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Bibliography: | Application Number: US202016831827 |