Polyamide compound

A novel polymer having self-healing properties is provided. The polyamide compound contains a dicarboxylic acid unit represented by the following formula (1) and a diamine unit represented by the following general formula (2). This polyamide compound is excellent in self-healing properties.

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Bibliographic Details
Main Author Lee, Chihan
Format Patent
LanguageEnglish
Published 11.01.2022
Subjects
CHEMISTRY
COMPOSITIONS BASED THEREON
MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
THEIR PREPARATION OR CHEMICAL WORKING-UP
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Summary:A novel polymer having self-healing properties is provided. The polyamide compound contains a dicarboxylic acid unit represented by the following formula (1) and a diamine unit represented by the following general formula (2). This polyamide compound is excellent in self-healing properties.
Bibliography:Application Number: US202016773199