Organic mold interconnects in shielded interconnects frames for integrated-circuit packages

A molded frame interconnect includes power, ground and signal frame interconnects in a molded mass, that encloses an integrated-circuit package precursor, which is inserted into the frame, and coupled to the frame interconnects by a build-up redistribution layer.

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Bibliographic Details
Main Authors Sir, Jiun Hann, Khoo, Poh Boon, Goh, Eng Huat
Format Patent
LanguageEnglish
Published 21.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A molded frame interconnect includes power, ground and signal frame interconnects in a molded mass, that encloses an integrated-circuit package precursor, which is inserted into the frame, and coupled to the frame interconnects by a build-up redistribution layer.
Bibliography:Application Number: US202016912653