Organic mold interconnects in shielded interconnects frames for integrated-circuit packages
A molded frame interconnect includes power, ground and signal frame interconnects in a molded mass, that encloses an integrated-circuit package precursor, which is inserted into the frame, and coupled to the frame interconnects by a build-up redistribution layer.
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
21.12.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A molded frame interconnect includes power, ground and signal frame interconnects in a molded mass, that encloses an integrated-circuit package precursor, which is inserted into the frame, and coupled to the frame interconnects by a build-up redistribution layer. |
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Bibliography: | Application Number: US202016912653 |