Semiconductor device

A semiconductor device includes a semiconductor element made up of a semiconductor substrate, an element electrode formed on the substrate, and a wiring layer electrically connected to the element electrode. The semiconductor device further includes a lead frame supporting the semiconductor element,...

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Bibliographic Details
Main Authors Shirai, Katsutoki, Higashida, Yoshio
Format Patent
LanguageEnglish
Published 07.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device includes a semiconductor element made up of a semiconductor substrate, an element electrode formed on the substrate, and a wiring layer electrically connected to the element electrode. The semiconductor device further includes a lead frame supporting the semiconductor element, a first conductive member electrically connecting the semiconductor element and the lead frame, a second conductive member overlapping with the semiconductor element as seen in plan view, and a sealing resin covering the semiconductor element, a part of the lead frame, and the first and second conductive member. The wiring layer includes a first pad portion and a second pad portion. The second conductive member has a first connecting portion bonded to the first pad portion and a second connecting portion bonded to the second pad portion.
Bibliography:Application Number: US201916429555