Low thermal budget annealing
Methods and systems for providing a short-duration anneal are provided. In one example, the methods and systems can include placing a workpiece in a thermal processing chamber. The workpiece can include a device side surface and an opposing non-device side surface. The methods and systems can includ...
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Main Author | |
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Format | Patent |
Language | English |
Published |
07.12.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Methods and systems for providing a short-duration anneal are provided. In one example, the methods and systems can include placing a workpiece in a thermal processing chamber. The workpiece can include a device side surface and an opposing non-device side surface. The methods and systems can include delivering an energy pulse from at least one heat source to the non-device side surface of the workpiece. In another example, the methods and systems can include depositing a layer of semiconductor material onto the semiconductor workpiece at the device side of the semiconductor workpiece. The methods and systems can include doping the layer of semiconductor material with a doping species and annealing the layer for crystallization using solid phase epitaxy. |
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Bibliography: | Application Number: US201916376031 |