Low thermal budget annealing

Methods and systems for providing a short-duration anneal are provided. In one example, the methods and systems can include placing a workpiece in a thermal processing chamber. The workpiece can include a device side surface and an opposing non-device side surface. The methods and systems can includ...

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Bibliographic Details
Main Author Timans, Paul J
Format Patent
LanguageEnglish
Published 07.12.2021
Subjects
BASIC ELECTRIC ELEMENTS
BLASTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
FURNACES
FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL
HEATING
KILNS
LIGHTING
MECHANICAL ENGINEERING
OPEN SINTERING OR LIKE APPARATUS
OVENS
RETORTS
SEMICONDUCTOR DEVICES
WEAPONS
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Summary:Methods and systems for providing a short-duration anneal are provided. In one example, the methods and systems can include placing a workpiece in a thermal processing chamber. The workpiece can include a device side surface and an opposing non-device side surface. The methods and systems can include delivering an energy pulse from at least one heat source to the non-device side surface of the workpiece. In another example, the methods and systems can include depositing a layer of semiconductor material onto the semiconductor workpiece at the device side of the semiconductor workpiece. The methods and systems can include doping the layer of semiconductor material with a doping species and annealing the layer for crystallization using solid phase epitaxy.
Bibliography:Application Number: US201916376031