Substrate having electronic component embedded therein

A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness di...

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Main Authors Jang, Jun Hyeong, Park, Yeo Il, Byun, Dae Jung, Park, Chang Hwa, Lee, Yong Duk, Jeong, Sang Ho, Na, Ki Ho, Park, Je Sang, Cha, Yoo Rim, Hwang, Mi Sun
Format Patent
LanguageEnglish
Published 23.11.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A substrate having an electronic component embedded therein includes a core structure including a first insulating body and a plurality of core wiring layers disposed on or in the first insulating body, and having a cavity penetrating at least a portion of the first insulating body in a thickness direction of the substrate and including a stopper layer as a bottom surface of the cavity, and an electronic component disposed in the cavity and attached to the stopper layer, and a surface of the stopper layer connected to the electronic component has a composite including at least two among a metal material, an inorganic particle, a filler, and an insulating resin.
Bibliography:Application Number: US202016809925