Wafer prober to facilitate testing of a wafer using nanosecond pulses

A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or mor...

Full description

Saved in:
Bibliographic Details
Main Authors Srinivasan, Raman, Burns, Sean, Zhuang, Yuanzhen, Morales, Lucas, Cheung, Siu Kwan, Li, Tao, Shi, Tian
Format Patent
LanguageEnglish
Published 23.11.2021
Subjects
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
Online AccessGet full text

Cover

More Information
Summary:A wafer testing system may comprise a chuck, a wafer carrier, a cathode plate, and a probe card. The chuck may be configured to hold the wafer carrier. The wafer carrier may be configured to hold a wafer on a surface of the wafer carrier, wherein the surface of the wafer carrier comprises one or more contact features protruding from the surface of the wafer carrier. The cathode plate may be configured to provide an electrical connection between the wafer carrier and the probe card, wherein a portion of a surface of the cathode plate is configured to be disposed on the one or more contact features of the wafer carrier. The probe card may be configured to test, using one or more probes associated with the probe card, the wafer when the wafer is on the surface of the wafer carrier.
Bibliography:Application Number: US202016917124