Heterojunction bipolar transistor
The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes: a first semiconductor layer including a device region; a second semiconductor layer under the first semiconductor layer; a laye...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
16.11.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes: a first semiconductor layer including a device region; a second semiconductor layer under the first semiconductor layer; a layer of conductive material between the first semiconductor layer and the second semiconductor layer; at least one contact extending to and contacting the layer of conductive material; and a device in the device region above the layer of conductive material. |
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Bibliography: | Application Number: US202016893855 |