Heterojunction bipolar transistor

The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes: a first semiconductor layer including a device region; a second semiconductor layer under the first semiconductor layer; a laye...

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Bibliographic Details
Main Authors Hwang, Jeonghyun, Stamper, Anthony K, Kantarovsky, Johnatan A, Aldridge, Jr., Henry L
Format Patent
LanguageEnglish
Published 16.11.2021
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Summary:The present disclosure relates to semiconductor structures and, more particularly, to heterojunction bipolar transistors and methods of manufacture. The structure includes: a first semiconductor layer including a device region; a second semiconductor layer under the first semiconductor layer; a layer of conductive material between the first semiconductor layer and the second semiconductor layer; at least one contact extending to and contacting the layer of conductive material; and a device in the device region above the layer of conductive material.
Bibliography:Application Number: US202016893855