Modular hybrid circuit packaging
An electronics package includes a platform and a board mounted to the platform, the board having electronics mounted thereon. A feedthrough pin passes through and is hermetically sealed to a feedthrough body and is wire bonded to the board. A cover is bonded to and surrounds the exterior surface of...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
19.10.2021
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Subjects | |
Online Access | Get full text |
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Summary: | An electronics package includes a platform and a board mounted to the platform, the board having electronics mounted thereon. A feedthrough pin passes through and is hermetically sealed to a feedthrough body and is wire bonded to the board. A cover is bonded to and surrounds the exterior surface of the feedthrough body to produce a hermetically sealed chamber that houses the platform and the board. |
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Bibliography: | Application Number: US201715636870 |