Semiconductor package

A semiconductor package includes a semiconductor chip disposed on a first substrate, a mold layer covering a sidewall of the semiconductor chip and including a through-hole, a second substrate disposed on the semiconductor chip, a connection terminal disposed between the first substrate and the seco...

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Bibliographic Details
Main Authors Park, Su-Min, Kim, Pyoungwan, Jang, Byoung Wook, Kim, Sunchul, Park, Junwoo, Kim, Hyunki, Kang, Inku, Jeong, Chanhee, Kim, Heeyeol
Format Patent
LanguageEnglish
Published 28.09.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package includes a semiconductor chip disposed on a first substrate, a mold layer covering a sidewall of the semiconductor chip and including a through-hole, a second substrate disposed on the semiconductor chip, a connection terminal disposed between the first substrate and the second substrate and provided in the through-hole, and an underfill resin layer extending from between the semiconductor chip and the second substrate into the through-hole.
Bibliography:Application Number: US201916698749