Semiconductor chip transfer method and transfer tool

• Main Authors: Singer, Frank, Schwarz, Thomas, Moosburger, Jürgen
• Format: Patent
• Language: English
• Published: 07.09.2021
• Subjects: BASIC ELECTRIC ELEMENTS; CONVEYING; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; HANDLING THIN OR FILAMENTARY MATERIAL; PACKING; PERFORMING OPERATIONS; PNEUMATIC TUBE CONVEYORS; SEMICONDUCTOR DEVICES; SHOP CONVEYOR SYSTEMS; STORING; TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING ORTIPPING; TRANSPORTING

A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier