Copper alloy for electronic/electric device, copper alloy sheet/strip material for electronic/electric device, component for electronic/electric device, terminal, and busbar

• Main Authors: Kawasaki, Kenichiro, Maki, Kazunari, Mori, Hiroyuki, Akisaka, Yoshiteru, Matsunaga, Hirotaka
• Format: Patent
• Language: English
• Published: 31.08.2021
• Subjects: ALLOYS; BASIC ELECTRIC ELEMENTS; CABLES; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMISTRY; CONDUCTORS; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; INSULATORS; METALLURGY; PERFORMING OPERATIONS; POWER SUPPLY LINES, AND DEVICES ALONG RAILS, FOR ELECTRICALLY-PROPELLED VEHICLES; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS; VEHICLES IN GENERAL

A copper alloy includes, by mass %: Mg: 0.15%-0.35%; and P: 0.0005%-0.01%, with a remainder being Cu and unavoidable impurities, wherein [Mg]+20×[P]<0.5 is satisfied. Among the unavoidable impurities, H is 10 mass ppm or less, O is 100 mass ppm or less, S is 50 mass ppm or less, and C is 10 mass ppm or less. In addition, 0.20<(NFJ2/(1−NFJ3))0.5≤0.45 is satisfied where a proportion of J3, in which all three grain boundaries constituting a grain boundary triple junction are special grain boundaries, to a total grain boundary triple junctions is NFJ3, and a proportion of J2, in which two grain boundaries constituting a grain boundary triple junction are special grain boundaries and one grain boundary is a random grain boundary, to the total grain boundary triple junctions is NFJ2.