Adhesive composition and hot-melt adhesive

The present invention provides an adhesive composition and a hot-melt adhesive that are suitably used for bonding a polyolefin resin substrate and a polar material, and that are capable of low-temperature adhesion. The adhesive composition comprises an acid-modified polypropylene (A), an unfunctiona...

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Bibliographic Details
Main Authors Yokomichi, Takuya, Kashihara, Kenji
Format Patent
LanguageEnglish
Published 31.08.2021
Subjects
ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE
ADHESIVES
CHEMISTRY
DYES
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL
PAINTS
PERFORMING OPERATIONS
POLISHES
TRANSPORTING
USE OF MATERIALS AS ADHESIVES
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Summary:The present invention provides an adhesive composition and a hot-melt adhesive that are suitably used for bonding a polyolefin resin substrate and a polar material, and that are capable of low-temperature adhesion. The adhesive composition comprises an acid-modified polypropylene (A), an unfunctionalized polypropylene (B), and a polyethylene (C), and has a melting point of 70 to 140° C.
Bibliography:Application Number: US201615770617