Processing liquid supplying apparatus, substrate processing apparatus and processing liquid supplying method

• Main Authors: Okuya, Yosuke, Iwahata, Shota, Higuchi, Ayumi, Fujita, Eri, Fujitani, Yoshiyuki, Mano, Masako, Takematsu, Yusuke
• Format: Patent
• Language: English
• Published: 17.08.2021
• Subjects: APPARATUS THEREFOR; BASIC ELECTRIC ELEMENTS; CHEMISTRY; CLEANING; CLEANING IN GENERAL; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; METALLURGY; PERFORMING OPERATIONS; PREVENTION OF FOULING IN GENERAL; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SEMICONDUCTOR DEVICES; TRANSPORTING

A processing liquid supplying apparatus supplies a processing liquid to a processing unit which processes a substrate. The processing liquid supplying apparatus includes a supply pipe to which a processing liquid inside a processing liquid tank that stores the processing liquid is fed and which supplies the processing liquid, which is fed from the processing liquid tank, to the processing unit, a return pipe which is branched and connected to the supply pipe to return a processing liquid inside the supply pipe to the processing liquid tank, a first heating unit which heats a processing liquid inside an upstream-side portion to be heated that is set in the supply pipe upstream from a branched position to which the return pipe is connected, a second heating unit which heats a processing liquid inside a downstream-side portion to be heated that is set in the supply pipe downstream from the branched position, a cooling unit which cools a processing liquid inside a portion to be cooled that is set in the return pipe, and a first filter which is interposed in the supply pipe upstream from the upstream-side portion to be heated and removes particles in a processing liquid.