Peeling solution composition for dry film resist

The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB.

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Bibliographic Details
Main Authors Lee, Jongsoon, Choi, Hosung, Bae, Jongil, Yang, Yunmo, Ha, Sangku, Kim, Kyusang
Format Patent
LanguageEnglish
Published 17.08.2021
Subjects
ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES
APPARATUS SPECIALLY ADAPTED THEREFOR
CANDLES
CHEMISTRY
CINEMATOGRAPHY
DETERGENT COMPOSITIONS
DETERGENTS
ELECTROGRAPHY
FATTY ACIDS THEREFROM
HOLOGRAPHY
MATERIALS THEREFOR
METALLURGY
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
RECOVERY OF GLYCEROL
RESIN SOAPS
SOAP OR SOAP-MAKING
USE OF SINGLE SUBSTANCES AS DETERGENTS
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Summary:The present invention relates to a peeling solution composition for dry film resist, which is usable for manufacturing a PCB for forming a microcircuit, and particularly is applicable for a process of manufacturing a flexible multi-layer PCB.
Bibliography:Application Number: US201916487905