Package module including a plurality of electronic components and semiconductor chip(s) embedded in a single package

• Main Authors: Lee, Jaekul, Park, Jinseon, Myung, Junwoo
• Format: Patent
• Language: English
• Published: 10.08.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A package module includes a core structure including a dummy member, one or more electronic components disposed around the dummy member, and an insulating material covering at least a portion of each of the dummy member and the electronic components, the core structure including a first penetration hole passing through the dummy member and the insulating material, a semiconductor chip disposed in the first penetration hole and having an active surface on which a connection pad is disposed and an inactive surface, an encapsulant covering at least a portion of each of the core structure and the semiconductor chip and filling at least a portion of the first penetration hole, and a connection structure disposed on the core structure and the active surface and including a redistribution layer electrically connected to the electronic components and the connection pad.