Method to predict yield of a device manufacturing process

A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical ch...

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Main Authors Menchtchikov, Boris, Ten Berge, Peter, Guittet, Pierre-Yves Jerome Yvan, Lercel, Michael James, Cekli, Hakki Ergün, Hastings, Simon Philip Spencer, Lin, Chenxi, Sonntag, Dag, Ypma, Alexander, Alvarez Sanchez, Ruben, Van Gorp, Simon Hendrik Celine, Liu, Shih-Chin, De Ruiter, Christiaan Theodoor, Duan, Wei, Tabery, Cyrus Emil
Format Patent
LanguageEnglish
Published 10.08.2021
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
CINEMATOGRAPHY
ELECTROGRAPHY
HOLOGRAPHY
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
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Summary:A method and associated computer program for predicting an electrical characteristic of a substrate subject to a process. The method includes determining a sensitivity of the electrical characteristic to a process characteristic, based on analysis of electrical metrology data including electrical characteristic measurements from previously processed substrates and of process metrology data including measurements of at least one parameter related to the process characteristic measured from the previously processed substrates; obtaining process metrology data related to the substrate describing the at least one parameter; and predicting the electrical characteristic of the substrate based on the sensitivity and the process metrology data.
Bibliography:Application Number: US201816497826