Method and apparatus for bonding communication technologies
A method and apparatus may include receiving data via a wide pipeline. The wide pipeline comprises a bonding of cable technology, electrical wiring technology, and a wireless technology. The method also includes configuring the data to be transmitted via at least one wireless channel. The method als...
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Main Author | |
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Format | Patent |
Language | English |
Published |
03.08.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A method and apparatus may include receiving data via a wide pipeline. The wide pipeline comprises a bonding of cable technology, electrical wiring technology, and a wireless technology. The method also includes configuring the data to be transmitted via at least one wireless channel. The method also includes transmitting the data via the at least one wireless channel to a user device. |
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Bibliography: | Application Number: US201715661692 |