Semiconductor memory device

According to one embodiment, a semiconductor memory device includes: first to fifth interconnects; a semiconductor layer having one end located between the fourth interconnect and the fifth interconnect and other end connected to the first interconnect; a memory cell; a conductive layer having one e...

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Bibliographic Details
Main Authors Hosotani, Keiji, Arai, Fumitaka, Momo, Nobuyuki
Format Patent
LanguageEnglish
Published 27.07.2021
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Summary:According to one embodiment, a semiconductor memory device includes: first to fifth interconnects; a semiconductor layer having one end located between the fourth interconnect and the fifth interconnect and other end connected to the first interconnect; a memory cell; a conductive layer having one end connected to the second interconnect and other end connected to the semiconductor layer; a first insulating layer provided to extend between the third and fourth interconnects and the semiconductor layer, and between the fifth interconnect and the conductive layer; an oxide semiconductor layer provided to extend between the fourth and fifth interconnects and the first insulating layer; and a second insulating layer provided to extend between the fourth and fifth interconnects and the oxide semiconductor layer.
Bibliography:Application Number: US201916502852