Semiconductor memory device
According to one embodiment, a semiconductor memory device includes: first to fifth interconnects; a semiconductor layer having one end located between the fourth interconnect and the fifth interconnect and other end connected to the first interconnect; a memory cell; a conductive layer having one e...
Saved in:
Main Authors | , , |
---|---|
Format | Patent |
Language | English |
Published |
27.07.2021
|
Subjects | |
Online Access | Get full text |
Cover
Loading…
Summary: | According to one embodiment, a semiconductor memory device includes: first to fifth interconnects; a semiconductor layer having one end located between the fourth interconnect and the fifth interconnect and other end connected to the first interconnect; a memory cell; a conductive layer having one end connected to the second interconnect and other end connected to the semiconductor layer; a first insulating layer provided to extend between the third and fourth interconnects and the semiconductor layer, and between the fifth interconnect and the conductive layer; an oxide semiconductor layer provided to extend between the fourth and fifth interconnects and the first insulating layer; and a second insulating layer provided to extend between the fourth and fifth interconnects and the oxide semiconductor layer. |
---|---|
Bibliography: | Application Number: US201916502852 |