Semiconductor device, method of manufacturing semiconductor device, inverter circuit, driving device, vehicle, and elevator

• Main Authors: Kimoto, Shinichi, Kyogoku, Shinya, Tanaka, Katsuhisa, Iijima, Ryosuke
• Format: Patent
• Language: English
• Published: 20.07.2021
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; SEMICONDUCTOR DEVICES

A semiconductor device according to an embodiment includes: a SiC layer having a first plane, a second plane, a first trench located on a first plane side, an n-type first SiC region, a p-type second SiC region between the first SiC region and the first plane, an n-type third SiC region between the second SiC region and the first plane, and a p-type fourth SiC region between the first SiC region and the first plane, at least a portion of the fourth SiC region located in the second SiC region, the fourth SiC region having a higher p-type impurity concentration than the second SiC region; a gate electrode in the first trench; a first electrode located on the first plane side; and a second electrode located on a second plane side. A depth of the fourth SiC region increases with distance from the first trench.