Ultrasonic sensor

A fixed frame (2) is fixed to an external member. An ultrasonic oscillator (3) is disposed inside the fixed frame (2) and includes a flexible first substrate and a first piezoelectric element deposited on the first substrate in the form of a thin film. The ultrasonic oscillator (3) is warped in resp...

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Bibliographic Details
Main Authors Ogata, Kenji, Kurogi, Shogo
Format Patent
LanguageEnglish
Published 20.07.2021
Subjects
ELECTRICITY
FOR PERFORMING MECHANICAL WORK IN GENERAL
GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES
MEASURING
METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PHYSICS
TESTING
TRANSPORTING
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Summary:A fixed frame (2) is fixed to an external member. An ultrasonic oscillator (3) is disposed inside the fixed frame (2) and includes a flexible first substrate and a first piezoelectric element deposited on the first substrate in the form of a thin film. The ultrasonic oscillator (3) is warped in response to expansion or contraction of the first piezoelectric element and generates ultrasonic waves. Actuator units (4) include a flexible second substrate coupling the first substrate to the fixed frame (2) and a second piezoelectric element deposited on the second substrate in the form of a thin film. The actuator units (4) are warped in response to expansion or contraction of the second piezoelectric element and cause the ultrasonic oscillator (3) to swing relative to the fixed frame (2). The fixed frame (2), the first substrate, and the second substrate are composed of the same substrate.
Bibliography:Application Number: US201816637407