Bus structure for parallel connected power switches

• Main Authors: Familiant, Yakov Lvovich, Rockhill, Andrew A, Rollmann, Paul J
• Format: Patent
• Language: English
• Published: 06.07.2021
• Subjects: APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC,OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWERSUPPLY SYSTEMS; BASIC ELECTRIC ELEMENTS; BOARDS, SUBSTATIONS, OR SWITCHING ARRANGEMENTS FOR THE SUPPLYOR DISTRIBUTION OF ELECTRIC POWER; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CONTROL OR REGULATION THEREOF; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUTPOWER; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; GENERATION; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; PRINTED CIRCUITS; SEMICONDUCTOR DEVICES

An apparatus includes a plurality of semiconductor switches. A first bus interconnects first terminals of the semiconductor switches in a first chain and provides a first impedance between the first terminals of switches of the first chain. A second bus interconnects second terminals of the semiconductor switches in a second chain and provides a second impedance greater that the first impedance between the second terminals of the switches of the second chain. The apparatus may be implemented as a laminated bus assembly including respective overlapping conductor plates, wherein the second bus includes a plate having subregions defined by features, such as slots or grooves, that provide the second impedance.