Semiconductor device with bond wire reinforcement structure
A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a mold...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
06.07.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a molding compound. The bond-wire reinforcement structure prevents wire sweep during molding and protects the wires from shorting with other wires. In one embodiment, the bond-wire reinforcement structure is formed with a fiberglass and liquid epoxy mixture. |
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Bibliography: | Application Number: US201816145203 |