Semiconductor device, method for manufacturing semiconductor device, inverter circuit, drive device, vehicle, and elevator

A semiconductor device according to an embodiment includes: a SiC layer having a first plane and a second plane facing the first plane, the SiC layer including a first trench on a first plane side, an n-type first SiC region, a p-type second SiC region, an n-type third SiC region located in this ord...

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Bibliographic Details
Main Authors Kimoto, Shinichi, Kyogoku, Shinya, Iijima, Ryosuke, Tanaka, Katsuhisa
Format Patent
LanguageEnglish
Published 22.06.2021
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Summary:A semiconductor device according to an embodiment includes: a SiC layer having a first plane and a second plane facing the first plane, the SiC layer including a first trench on a first plane side, an n-type first SiC region, a p-type second SiC region, an n-type third SiC region located in this order from the second plane to the first plane, a p-type fourth SiC region between the first SiC region and the first trench, a fifth SiC region between the first SiC region and the first plane, and a sixth SiC region between the fourth SiC region and the fifth SiC region, and the sixth SiC region having an n-type impurity concentration higher than an n-type impurity concentration of the first SiC region; a gate electrode in the first trench; a first electrode on the first plane side; and a second electrode on a second plane side.
Bibliography:Application Number: US202016797643