Method of manufacture of a FinFET device

A semiconductor device and method of manufacture are provided in which an the physical characteristics of a dielectric material are modified in order to provide additional benefits to surrounding structures during further processing. The modification may be performed by implanting ions into the diel...

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Main Authors Tsai, Chia-Ching, Hsu, Li-Te, Chiu, Yi-Wei
Format Patent
LanguageEnglish
Published 22.06.2021
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Abstract A semiconductor device and method of manufacture are provided in which an the physical characteristics of a dielectric material are modified in order to provide additional benefits to surrounding structures during further processing. The modification may be performed by implanting ions into the dielectric material to form a modified region. Once the ions have been implanted, further processing relies upon the modified structure of the modified region instead of the original structure.
AbstractList A semiconductor device and method of manufacture are provided in which an the physical characteristics of a dielectric material are modified in order to provide additional benefits to surrounding structures during further processing. The modification may be performed by implanting ions into the dielectric material to form a modified region. Once the ions have been implanted, further processing relies upon the modified structure of the modified region instead of the original structure.
Author Tsai, Chia-Ching
Chiu, Yi-Wei
Hsu, Li-Te
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Snippet A semiconductor device and method of manufacture are provided in which an the physical characteristics of a dielectric material are modified in order to...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Method of manufacture of a FinFET device
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