Method of manufacture of a FinFET device

A semiconductor device and method of manufacture are provided in which an the physical characteristics of a dielectric material are modified in order to provide additional benefits to surrounding structures during further processing. The modification may be performed by implanting ions into the diel...

Full description

Saved in:
Bibliographic Details
Main Authors Tsai, Chia-Ching, Hsu, Li-Te, Chiu, Yi-Wei
Format Patent
LanguageEnglish
Published 22.06.2021
Subjects
Online AccessGet full text

Cover

Loading…
More Information
Summary:A semiconductor device and method of manufacture are provided in which an the physical characteristics of a dielectric material are modified in order to provide additional benefits to surrounding structures during further processing. The modification may be performed by implanting ions into the dielectric material to form a modified region. Once the ions have been implanted, further processing relies upon the modified structure of the modified region instead of the original structure.
Bibliography:Application Number: US201916665474