Multi-lenslet PIC imagers and packaging configurations

A dual-lenslet array photonic integrated circuit (PIC) imager includes a PIC and top and bottom substrate spacers. A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC. Lenslets of...

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Bibliographic Details
Main Authors Ogden, Chad E, Badham, Katherine Emily, Chriqui, Guy, Kendrick, Richard L
Format Patent
LanguageEnglish
Published 15.06.2021
Subjects
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
MEASURING
MEASURING ANGLES
MEASURING AREAS
MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
MEASURING LENGTH, THICKNESS OR SIMILAR LINEARDIMENSIONS
OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
OPTICS
PHYSICS
PICTORIAL COMMUNICATION, e.g. TELEVISION
TESTING
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Summary:A dual-lenslet array photonic integrated circuit (PIC) imager includes a PIC and top and bottom substrate spacers. A first optical prism couples a first lenslet array to a first-side edge of the PIC. A second optical prism couples a second lenslet array to a second-side edge of the PIC. Lenslets of the first lenslet array and respective lenslets of the second lenslet array are coupled to respective waveguides embedded in the in the PIC.
Bibliography:Application Number: US201916287980