Method of manufacturing an ultrasonic probe

• Main Authors: Kim, Young-il, Choi, Min-seog, Jeon, Tae-ho, Song, Jong-keun
• Format: Patent
• Language: English
• Published: 01.06.2021
• Subjects: ACOUSTICS; ACOUSTICS NOT OTHERWISE PROVIDED FOR; DEAF-AID SETS; DIAGNOSIS; ELECTRIC COMMUNICATION TECHNIQUE; ELECTRICITY; FOR PERFORMING MECHANICAL WORK IN GENERAL; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL; HUMAN NECESSITIES; HYGIENE; IDENTIFICATION; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES; LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKEACOUSTIC ELECTROMECHANICAL TRANSDUCERS; MEASURING; MEDICAL OR VETERINARY SCIENCE; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING,NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; MUSICAL INSTRUMENTS; PERFORMING OPERATIONS; PHYSICS; PUBLIC ADDRESS SYSTEMS; SOUND-PRODUCING DEVICES; SURGERY; TESTING; TRANSPORTING

Provided are an ultrasonic probe and a method of manufacturing the same. The method includes: forming a plurality of grooves by removing regions of a first insulating layer and a first silicon wafer from a first substrate including the first silicon wafer and the first insulating layer; bonding a second substrate including a second silicon wafer, a second insulating layer, and a silicon thin layer to the first substrate, such that the plurality of grooves turn into a plurality of cavities; removing the second silicon wafer from the second substrate; forming transducer cells on regions of the second insulating layer corresponding to the plurality of cavities; and forming a plurality of unit substrates by cutting the first substrate, the silicon thin layer, and the second insulating layer.