Power module package
Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is s...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
11.05.2021
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Subjects | |
Online Access | Get full text |
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Summary: | Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member. |
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Bibliography: | Application Number: US201414513456 |