Ethylene interpolymer products and films

• Main Authors: Konaganti, Vinod, Keshtkar, Mehdi, Kazemi, Niousha, Gillon, Bronwyn, Kasiri, Sepideh, Goyal, Shivendra Kumar, Taylor, Kenneth Edward, Kleczek, Monika, Sibtain, Fazle, Salomons, Stephen
• Format: Patent
• Language: English
• Published: 04.05.2021
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; GENERAL PROCESSES OF COMPOUNDING; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

This disclosure relates to ethylene interpolymer compositions and films prepared therefrom. Specifically: ethylene interpolymer products having: a dimensionless Long Chain Branching Factor, LCBF, greater than or equal to 0.001; a residual catalytic metal of from ≥0.03 to ≤5 ppm of hafnium, and; a dimensionless unsaturation ratio, UR, of from ≥−0.40 to ≤0.06, wherein UR is defined by the following relationship; UR=(SCU−TU)/TU, where SCU is the amount of a side chain unsaturation per 100 carbons and TU is amount of a terminal unsaturation per 100 carbons, in said ethylene interpolymer product. The disclosed ethylene interpolymer products have a melt index from about 0.3 to about 500 dg/minute, a density from about 0.855 to about 0.975 g/cc, a polydispersity (Mw/Mn) from about 1.7 to about 25 and a Composition Distribution Breadth Index (CDBI50) from about 1% to about 98%.