Systems, methods, and devices for mechanical isolation or mechanical damping of microfabricated inertial sensors

• Main Authors: Kranz, Michael S, Dean, Jr., Robert Neal, Adams, Mark Lee, Bottenfield, Brent Douglas, English, Brian A, Bond, III, Arthur Gernt, Rudd, Carl
• Format: Patent
• Language: English
• Published: 27.04.2021
• Subjects: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES; MICROSTRUCTURAL TECHNOLOGY; PERFORMING OPERATIONS; TRANSPORTING

MEMS-based sensors can experience undesirable signal frequencies caused by vibrations, shocks, and accelerations, among other phenomena. A microisolation system can isolate individual MEMS-based sensors from undesirable signal frequencies and shocks. An embodiment of a system for microisolation of a MEMS-based sensor can include an isolation platform connected to one or more folded springs. Another embodiment of a system for microisolation can include an isolation platform and/or a frame connected to a mesh damping mechanism. In at least one embodiment, a mesh damping mechanism can be a microfibrous metal mesh damper. In one or more embodiments, a system for microisolation can include an isolation platform connected to one or more L-shaped springs, and a thickness of the one or more L-shaped springs can be less than a thickness of the isolation platform.