MEMS component having low-resistance wiring and method for manufacturing it
A MEMS component including a first substrate having at least one first insulating layer and a first metallic coating on a first side; and including a second substrate having at least one second insulating layer and a second metallic coating on a second side, the second substrate including a micromec...
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Main Author | |
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Format | Patent |
Language | English |
Published |
27.04.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A MEMS component including a first substrate having at least one first insulating layer and a first metallic coating on a first side; and including a second substrate having at least one second insulating layer and a second metallic coating on a second side, the second substrate including a micromechanical functional element, which is connected electroconductively to the second metallic layer. The first side and the second side are positioned on each other, the first insulating layer and the second insulating layer being interconnected, and the first metallic coating and the second metallic coating being interconnected. A method for manufacturing a MEMS component is also described. |
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Bibliography: | Application Number: US201715807811 |